Number of layers

UP to16L

UP to 30L

Laminate

FR-4, Halogen free, High TG, Cem-3, PTFE, Aluminum  BT, Rogers

Maximum board size

610*460mm

762*508mm

Board thickness

0.3-3.5mm

0.21-6.0mm

Minimum line width/space

0.1/0.1mm

0.076/0.076mm

Minimum line gap

+/-15%

+/-10%

Outer layer copper thickness

140um

245um

Inner layer copper thickness

70um

245um

Min.finished hole size(mechanical)

0.2mm

0.15mm

Min.finished hole size (laser hole)

0.1mm

0.1mm

Aspect ratio

10:01

20：1

Solder mask color

Green、Blue、Black、White、Yellow、Red、Grey

Impedance control tolerance

<=+/-10%

Surface Treatment

Flash gold

0.025-0.075um

0.025-0.5um

Immersion gold

0.05-0.1um

0.1-0.2um

Sn/Pb HASL

1-70um

Leadfree HASL

1-70um

Immersion silver

0.08-0.3um

OSP(Entek)

0.2-0.4um

Gold finger

0.375um<x<1.75um

>=1.75um

Hard gold plating

0.375um<x<1.75um

>=1.75um

Immsion Sn

0.8um<x<=1.20um

V-Cut

V-Cut degree

20,30,45,60

Outline Profile

Chamfer

The angle type of the chamfer

30,45,60

Plug via hole

Max.size can be plugged

0.6mm

0.7mm

Largest NPTH hole size

6.5mm

>6.5mm

Largest PTH hole size

6.5mm

>6.5mm

Min.annular ring can be kept

0.15mm

0.1mm

Min.distance between the IC
pads can keep Sm bridge

0.25mm

0.18mm

Min.SM bridge for green soldermask

0.1mm

0.076mm

Min.SM bridge for black soldermask

0.125mm

0.1mm

Tolerance of dimension size

<=+/-0.13mm

+/-0.1mm

Tolerance of board thickness

>=1.0mm   +/-10%

+/-8%

<1.0mm     +/-0.1mm

Tolerance of finished NPTH hole size

+/-0.05mm

+/-0.05mm

Tolerance of finished PTH hole size

+/-0.076mm

+/-0.05mm

Delivery time

Mass：10~12D

Sample：5~7D

Capacity

60000sq/m

CAM capability

20 Items

100-180 Items