File Formats

Gerber files(preferred), AutoCAD, DWG

274-X,274-D, DXF, …

BOM (Bill of Materials)

Excel(preferred), PDF

Pick and Place file (XYRS)

X & Y coordinates

Board type

 Board types for assembly

Rigid, Flexible, Rigid-Flex

Board Size

Minimum and Maximum

Smallest size: 2.0” x 2.0”, 50mm x 50mm,Largest size: 19.7” x 19.7”, 500mm x 500mm

Solder paste printing

Max stencil size

1560mm x 450mm

Pick and Place

Min. SMT part package

0201

Min. IC pitch

0.3mm

Min.chip size

01 005

QFP lead pitch

0.38mm to 2.54mm

BGA capability

BGA ball pitch

0.5mm to 3.00 mm

BGA ball size

0.4mm to 1.0mm

Reballing and Rework (De-population and Re-population)

Reflow

Optimized Reflow Profiling and multi-zone temperature control

Wave flow

temperature control and tooling

Assembly and builds

Press Fit Connectors

Yes

Mechanical Assembly and Box Builds

Yes

Cable & Harness Assembly

Yes

Rework

De-population and Re-population

Yes

Fine Pitch

Yes

Cuts & Jumps

Yes

Minor PCB Repair

Yes

Wash

De-ionized Wash

Yes

Testing

Visual Inspection

Yes

AOI (Automated Optical Inspection)

Yes

ICT (In Circuit Test)

Yes

X-Ray

Yes

Functional Test

Yes

Firmware loading

Yes